KD Marketplace Insights has printed a brand new record on Wafer Backgrinding Tape Marketplace research and forecast 2019-2026. The record contains of Wafer Backgrinding Tape Marketplace dimension, Y-o-Y enlargement research, and marketplace dynamics, together with enlargement drivers, restraining components, alternatives, and traits which can be spearheading present nature and long term standing of the marketplace.
The worldwide wafer backgrinding tape marketplace dimension is anticipated to succeed in $261.4 million via 2026, rising at a CAGR of four.9% from 2019 to 2026. Wafer backgrinding is an built-in procedure within the fabrication of semiconductor gadgets. Previous to the method of backgrinding, wafers are laminated via other form of backgrinding tapes to steer clear of floor injury within the means of backgrinding and in addition offer protection to from the wafer floor contamination brought about via infiltration of grinding fluid. Minimization of quite a lot of semiconductor elements calls for the usage of wafer backgrinding considerably. Subsequently, with technological development and utilization of extra compact & transportable gadgets, backgrinding has turn out to be a very powerful level of wafer designing & integration. Thus, significance of wafer backgrinding within the fabrication of semiconductor calls for wafer backgrinding tape for shielding wafer’s floor, which in flip fuels the marketplace enlargement.
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Wafer backgrinding tapes totally offer protection to the wafer floor throughout backgrinding and in addition save you wafer floor contamination from infiltration of grinding fluid. Utilization of wafer backgrinding tapes in wafer fabrication guarantees precision in wafer thickness after backgrinding. Wafer backgrinding tapes are basically utilized in processing semiconductor wafers produced from fabrics equivalent to silicon or glass. Its tough adhesive energy helps to keep wafers in position when grinding and chopping. As soon as the wafer has been processed, exposing the tape to ultraviolet mild (UV) reduces its adhesive energy, making tape peeling or die pick out up easy.
The standards equivalent to build up in call for for ultra-thin wafers, upward push in want for wafer fabrication, build up in center of attention towards wafer floor coverage throughout grinding procedure, and enlargement within the semiconductor trade spice up the expansion of the wafer backgrinding tape marketplace globally. Then again, build up in shift from non-UV to UV curable backgrinding tapes that build up the whole value of wafer production is anticipated to abate the marketplace enlargement. Moreover, build up in funding in wafer fabrication apparatus and fabrics, particularly in Korea and China, is anticipated to supply profitable alternatives for the marketplace growth.
The worldwide wafer backgrinding tape marketplace is segmented at the foundation of sort, wafer dimension, and area. In keeping with sort, the marketplace is bifurcated into UV curable and non-UV tape varieties. In keeping with wafer dimension, the marketplace is split into 6-inch, 8-inch, 12-inch, and others. In keeping with area, it’s analyzed throughout North The usa, Europe, Asia-Pacific, and LAMEA together with their outstanding international locations.
The important thing gamers profiled within the record come with Furukawa Electrical Co. Ltd., Mitsui Chemical substances, Inc., Nitto Denko Company, Minitron Elektron GMBH, Denka Corporate Restricted, Lintec of The usa Inc., AI Generation, Inc., Power-One Carried out Fabrics Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd.
Those key gamers have followed methods equivalent to product portfolio growth, mergers & acquisitions, agreements, geographical growth, and collaborations to give a boost to their marketplace penetration.
KEY BENEFITS FOR STAKEHOLDERS
– This find out about contains the analytical depiction of the worldwide wafer again grinding marketplace together with the present traits and long term estimations to decide the upcoming funding wallet.
– The record items knowledge in regards to the key drivers, restraints, and alternatives.
– The present marketplace is quantitatively analyzed from 2018 to 2026 to focus on the monetary competency of the trade.
– Porter’s 5 forces research illustrates the efficiency of the patrons and providers within the trade.
GLOBAL WAFER BACKGRINDING TAPE MARKET SEGMENTATION
– UV Curable
BY WAFER SIZE:
North The usa
– Remainder of Europe
– South Korea
– Remainder of Asia-Pacific
– Latin The usa
– Heart East & Africa
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Desk of Content material
CHAPTER 1: INTRODUCTION
1.1. Record description
1.2. Key advantages for stakeholders
1.3. Key marketplace segments
1.4. Analysis method
1.4.1. Number one analysis
1.4.2. Secondary analysis
1.4.3. Analyst gear and fashions
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO standpoint
CHAPTER 3: MARKET OVERVIEW
3.1. Marketplace definition and scope
3.2. Key findings
3.2.1. Most sensible impacting components
3.2.2. Most sensible funding wallet
3.2.3. Most sensible successful methods
3.3. Porter’s 5 forces research
3.4. Marketplace proportion research (2018)
3.5. Marketplace dynamics
220.127.116.11. Building up in call for for ultra-thin wafers
18.104.22.168. Upward push in want for wafer fabrication
22.214.171.124. Building up in center of attention towards wafer floor coverage throughout grinding procedure
126.96.36.199. Expansion within the semiconductor trade
188.8.131.52. Building up in value of wafer production
184.108.40.206. Building up in funding in wafer fabrication apparatus and fabrics
3.6. Wafer production evaluation
3.7. Wafer fabrication
3.7.1. Varieties of wafer fabrication procedure
220.127.116.11. Entrance-end procedure
18.104.22.168. Again-end procedure
3.7.2. Processes concerned throughout wafer fabrication
22.214.171.124. Chemical Mechanical Planarization
126.96.36.199. Ion implementation
188.8.131.52. Meeting and trying out
3.7.3. Wafer grinding procedure (wafer thinning)
3.7.4. Form of wafer thinning
184.108.40.206. Standard grinding
3.7.5. Machines and elements required throughout wafer backgrinding
3.8. Backgrinding tapes buyer packages and utilization
3.8.1. Buyer packages of backgrinding tape
3.8.2. Utilization of backgrinding tape
3.9. Generation traits
3.9.1. Fabrics utilized in tapes
3.9.2. Applied sciences used to cut back the cycle time of backgrinding procedure
3.9.3. Upgrades in tape production machines
CHAPTER 4: WAFER BACKGRINDING TAPE MARKET, BY TYPE
4.2. UV Curable
4.2.1. Key marketplace traits, enlargement components, and alternatives
4.2.2. Marketplace dimension and forecast, via area
4.2.3. Marketplace research, via nation
4.3.1. Key marketplace traits, enlargement components, and alternatives
4.3.2. Marketplace dimension and forecast, via area
4.3.3. Marketplace research, via nation
CHAPTER 5: WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE
5.2.1. Key marketplace traits, enlargement components, and alternatives
5.2.2. Marketplace dimension and forecast, via area
5.2.3. Marketplace research, via nation
5.3.1. Key marketplace traits, enlargement components, and alternatives
5.3.2. Marketplace dimension and forecast, via area
5.3.3. Marketplace research, via nation
5.4.1. Key marketplace traits, enlargement components, and alternatives
5.4.2. Marketplace dimension and forecast, via area
5.4.3. Marketplace research, via nation
5.5.1. Key marketplace traits, enlargement components, and alternatives
5.5.2. Marketplace dimension and forecast, via area
5.5.3. Marketplace research, via nation
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